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Product Specifications

Product Specifications

 

Diamond

wire

 

Specifica

-tion

Finished

Product

Diameter

Core Wire

Diameter

Minimum

Breaking Tension

Applications

(μm)(μm)(N)

47

62±2

47±2

9.0

         Silicon Slicing

50

65±5

50±2

9.5

52

67±2

52±2

10.5

55

70±2

55±2

11

57

72±2

57±2

12.5

60

75±2

60±2

13

80

110±2

80±2

20

Crystal Material Cutting

110

160±2

110±2

35

MagneticMaterial Cutting

120

170±2

120±2

40

130

200±2

130±2

48

160

230±2

160±2

70

Sapphire Cutting

180

250±2

180±2

88

260

350±2

260±3

180

Silicon Squaring

300

390±2

300±3

230


Machines Matching

Machine anufacturer

Machine Type

Linton

1660、1665

Shang Ji

WSK027、WSK018

Meyerburger

DW288(+)、DW288、S3、MB264、MB271

NTC

PV500、PV600、P、NTC44